这台机器采用干涉原理,只要能反射就能测.
具体资料如下,有用得着的请与我联系:
Fringe sensitivity range: continuously variable from 0.5 to 10 micrometers/fringe System accuracy: 0.25 micrometers Maximum test area: 5.0" x 4.5" (major x minor axes) Maximum resolution: 0.10 micrometers Work holder: tilt adjustable in 2 dimensions; accomodates 4 x 4", 5 x 5" photoplates as well as 2", 3", 100mm, and 200mm wafers and slices. Viewing screen: RCA bw CCTV monitor with 9" CRT Light source: HeNe laser Power input: 67 watts
价钱多少?
请问可以测其他晶体么
测硅片时是单面测量么?
如何夹持,是真空么?
是自动的还是手动的?
能测绘出测量区域的形貌图么?
我对这类设备倍感兴趣,所里面正在选购,不知道怎么和你联系啊?
我:zhigang11@sina.com。方便联系我啊
single side measurement for flatness, vacuum to hold the wafer, it can display the wafer contour
还有,最小只能测到0.5微米吗? max resolution: .1um
双面抛光能检测吗?yes 是自动的还是手动的? manual
直拉的硅片也能测
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