半导体晶圆制造设备货品清单

乏味 · 发表于 2007-5-16 19:59:00

项次
设备类别
ECCN
对应之货品号列(C.C.C)
货品名称

1
供半导体晶圆铜导线用之化学机械研磨机 Chemical machanical polisher(CMP)
(WA未列管)
8464.20.10.00-7
供半导体晶圆制程用之磨光、拋光及研磨机器Grinding, polishing and lapping machines for processing of semiconductor wafers

2
供半导体晶圆制造用之光阻剥除机Photo-resist stripper
(WA未列管)
8456.99.30.00-9
去除光阻物或清洗半导体晶圆之器具Apparatus for stripping or cleaning semiconductor wafers

3
供半导体晶圆制造用之光阻显影机Photo-resist developer
3.B.1.f
8479.89.83.00-0
供湿蚀刻、显影、去除光阻物或清洗半导体晶圆及平板显示器之器具Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays

4
供半导体晶圆制造用之快速高温热处理机Rapid thermal processor(RTP)
3.B.1.a
8514.30.10.00-5
半导体晶圆快速加热器具Apparatus for rapid heating of semiconductor wafers

5
供半导体晶圆制造用之沉积设备Deposition apparatus
1.B.1.d, 2.B.5.a, 3.B.1.a, 3.B.1.d, 3.B.1.e
8419.89.60.00-0
生产半导体用化学蒸着沉积器具Chemical vapor deposition apparatus for semiconductor production

8479.89.82.00-1
供溅镀半导体晶圆产生物理气相沉积之器具Apparatus for physical deposition by sputtering on semiconductor wafers

8479.89.86.00-7
半导体晶圆叠晶沉积机Epitaxial deposition machines for semiconductor wafers

8479.89.88.00-5
制造半导体用之物理气相沉积器具Physical deposition apparatus for semiconductor production

8479.89.91.00-0
生产半导体用化学蒸着沉积器具，非属第8419.89目者Chemical vapor deposition apparatus for semiconductor production other than articles of subheading No. 8419. 89

6
供半导体晶圆制造用之洗净设备Cleaning equipment
(WA未列管)
8424.89.22.00-0
供蚀刻、去除光阻物或清洗半导体晶圆之喷洒机具Spraying appliances for etching, stripping or cleaning semiconductor wafers

7
供半导体晶圆制造用之干燥机 Dryer
(WA未列管)
8421.19.10.00-2
半导体晶圆加工用旋转干燥机Spin dryers for semiconductor wafer processing

8479.89.89.00-4
供感光乳剂涂附在半导体晶圆上之旋转器Spinners for coating photographic emulsions on semiconductor wafers

8
供半导体晶圆制造用之电子显微镜Electron microscopes
3.B.1.f
9011.20.10.00-3
附有专供半导体晶圆或网线上下料及传送设备用之显微照相显微镜Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles

9012.10.10.00-4
附有专供半导体晶圆或网线上下料及传送设备用之电子束显微镜Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or retices

9
供半导体晶圆制造用之蚀刻机Etcher
3.B.1.c, 3.B.1.e
8456.91.00.00-3
供半导体材料干式蚀刻图形用工具机Machine-tools for dry-etching patterns on semiconductor materials

8543.30.10.00-0
供湿蚀刻、显影、去除光阻物或清洗半导体晶圆及平板显示器之器具Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays

10
供半导体晶圆制造用之离子植入机Ion implanter
3.B.1.b
8543.11.00.00-5
供掺杂半导体材料之离子植入器 Ion implanters for doping semiconductor materials

11
供半导体晶圆制造用之光阻涂布机Photo-resist coater
3.B.1.f
8479.89.99.30-6
制造半导体晶圆用之光阻涂布器具 Photo-resist coaters for semiconductor wafers

12
供半导体晶圆制造用之微影设备 lithography equipment
3.B.1.f
9010.42.00.10-8
生产半导体晶圆用之步进对准机 Steppers for semiconductor wafers

9010.42.00.20-6
生产半导体晶圆用之扫描对准机Scanners for semiconductor wafers

8456.99.20.10-9
半导体制程中，供制造光罩及网线之电子束直写机E-beam writers to produce masks and reticles for patterns on semiconductor devices

wuxijijie · 发表于 2007-6-7 09:20:47

比较齐全就是有一点不太还,我还没全部用到过呵呵!

验证 · 发表于 2007-8-22 17:31:29

象天书一样,毕竟是隔行如隔山啊


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半导体晶圆制造设备货品清单

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