ficonTEC AL2000 – 光电器件的自动组装系统

ac0022 · 发表于 2008-4-15 14:27:10

ficonTEC supplies semi-automatic and fully automated production and testing systems, concentrating on the optical industry, laser diode manufacture, optoelectronics, medical technology, security and military engineering and telecommunications.
ficonTEC提供半自动以及全自动的生产及测试系统，主要涉及光学、激光器制造、光电子、医疗技术、安保及军事工程和通讯等领域。

ficonTEC is the partner for automation in photonics – world-wide. We understand your products and processes and support you with our systems, know-how and experience.
在光电行业，ficonTEC是您的全球合作伙伴。我们了解您的产品及其工艺，并通过我们的系统、技能及经验给您予支持。

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ficonTEC GmbH is the world leader in manufacturing of automated assembly, test and inspection equipment for micro systems and opto-electronics components, based on a flexible modular platform. ficonTEC specializes in the design, development and construction of fully customised or standard, modular automated, or semi-automated system solutions, particularly in the photonics industry for High Power Diode Laser (HPDL), Laser Welding and Automated Fiber Alignment.
ficonTEC GmbH是全球自动化组装、测试及检测设备的领先者，其设备基于灵活的模块化平台，应用于微系统及光电器件方面。ficonTEC专业于客户定制或标准的模块化全自动或半自动的系统解决方案的设计、开发和制造，尤其擅长于光电子行业的大功率激光器的加工、激光焊接和光纤的自动耦合。

ficonTEC AL2000 – Automated Photonic Devices Assembly System
ficonTEC AL2000 – 光电器件的自动组装系统

Today’s photonic devices are increasingly complex in design, configuration and application. Such factors, driven by the dynamic business environment demand a versatile assembly system that can satisfy both performance and cost-of-ownership .
时至今日，光电器件的设计、配置及应用方面变得越来越复杂，同时商业环境瞬息万变，在这些因素的驱动下，只有灵活的组装系统才可以满足客户对系统性能及产品成本的要求。

ficonTEC introduces the next-generation AL2000, which system architecture enables the maximum flexibility for diverse device assembly requirements and applications. The platform. consists of 6-degree of independent axes for submicron precision alignment that addresses all possible degrees of optical (and mechanical) axes, and almost equally accurate pick-and-place positioning capability. It provides various bonding options, including both UV- and thermal-epoxy, soldering, and laser welding with about 1 µm post-bond-shift accuracy. Various fully automated assembly processes have already been implemented. These include:
ficonTEC推出下一代的AL2000系统，该系统的体系结构可以为形形色色器件的组装及应用提供最大的灵活性。系统平台包括六个自由度、独立的轴坐标，提供微米级的精确耦合，能够满足几乎所有的光学（机械）自由度的要求，和同样精确的拾取定位能力。系统提供不同的粘合方式，包括紫外光热固化、烧焊、激光熔焊等，粘合后漂移的精确度可以达到一微米。各种各样的全自动组装程序也可以整合到系统中。应用包括：

+    FTTx transceiver assembly
   FTTx收发器的组装
+       Laser array assembly (e.g., printing applications)
激光器阵列的组装（例如：激光打印的应用）
+       Pressure sensors
压力感应器
+       Miniature camera modules (e.g., automotive applications)
微型相机模组（例如：汽车方面的应用）
+       Micro-lens positioning and assembly (via epoxy dispensing)
微透镜的定位和组装（环氧树脂）
+       Miniature solid state laser assembly (e.g., display applications)
微型固体激光器组装（例如：显示应用）
+       Planar parallel placement of CCD-arrays
平面平行放置的CCD阵列


The AL2000 embodies ficonTEC’s process expertise in various device assembly and automation, as the fully proven process is typically delivered with the system.
AL2000在交付系统的同时提供充分验证的组装程序，体现了ficonTEC在各种器件组装和自动化中，对系统组装程序的专业知识。

ficonTEC AL2000 – 光电器件的自动组装系统

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