|
|
反应溅射镀膜技术与离子镀技术的异同
The Similarities and Differences Between the Technology of Reactive Sputtering Coating Technology and Ion Plating
下载全文
反应溅射镀膜技术与离子镀技术的异同.pdf
(141.13 KB, 下载次数: 1)
作 者:韩旭 朱琳 董群 于海
HAN Xu, ZHU Lin, DONG Qun, YU Hal (Shenyang Siasun Robot & Automation Co., Ltd, Shenyang 110168, China)
机构地区:沈阳新松机器人自动化股份有限公司,辽宁沈阳110168
出 处:《装备制造技术》 2015年第1期 211-212页,共2页
摘 要:反应磁控溅射技术与离子镀技术在薄膜特点、成膜环境以及使用范围等方面有很多相同之处,从本质上来看都属于溅射镀膜技术,但从产生机理上看还是有一些区别的,本文将从两种技术的发生原理、常见特点和工艺角度阐述其不同点。
Reactive magnetron sputtering ion plating technology and there are many similarities in the aspects of film,film forming characteristics of environment and the use scope,see all belong to the sputtering technology in nature,but from the generation mechanism of view there are some differences,this paper will expound their different points from two kinds of technology principle,common characteristics and the point of view of technology.
关键词:反应溅射技术 离子镀技术 真空镀膜
reactive sputtering technology ; ion plating technique ; vacuum coating ; |
|